Lattice’s SB6212 and SB6213 USB3 Devices Improve Ease of Use and
Reliability of Connecting the Tablet to the Docking Cradle
SiBEAM Snap technology provides a short range 60 GHz wireless link
that delivers up to 12 Gb/s of data transfer
Proven technology improves system robustness and industrial design by
eliminating physical connectors
PORTLAND, Ore.--(BUSINESS WIRE)--Jan. 9, 2018--
Semiconductor Corporation (NASDAQ: LSCC), the leading provider of
customizable smart connectivity solutions, today announced that its SiBEAM®
Snap™ technology will be integrated in Fujitsu’s next-generation
Tablet PC, model Q508. The Q508 will be the first tablet supporting USB
3.1 data transfers at 5 Gbps wirelessly and will be displayed during CES
2018. The product will be available in Japan starting in January 2018.
“SiBEAM Snap technology optimizes performance for battery-powered
applications and provides a seamless, ultra-fast wireless data
connection that makes it an ideal solution for Fujitsu’s Tablet PC,”
said Susumu Nikawa, CTO at Fujitsu Client Computing Ltd. “By eliminating
physical connectors, SiBEAM Snap technology enabled us to produce a much
more robust product design.”
This latest design win further demonstrates that Lattice’s SiBEAM Snap
wireless connector technology offers a unique advantage in data transfer
for a variety of high volume mobile applications, such as smartphones,
tablets and notebooks. The production-proven solution also has the
ability to extend to broader applications across the consumer and
industrial markets – encouraging innovation in Edge connectivity devices
for smart homes, smart factories, and more.
“SiBEAM Snap technology completely replaces common connectors such as
USB, while ensuring high-bandwidth wireless data transfer for a truly
connector-free device,” said C.H. Chee, senior director of marketing at
Lattice Semiconductor. “We are excited to see continued adoption of
SiBEAM Snap products across more mobile applications, and anticipate
broader adoption where a robust low power, fast wireless data transfer
To learn more about SiBEAM Snap technology, please visit http://www.latticesemi.com/en/Products/mmWave/SiBEAMSnap.aspx?pr010918.
Lattice at the CES 2018 – Las Vegas, NV
Lattice will be exhibiting at CES 2018 in Las Vegas from Tuesday, Jan. 9
to Friday, Jan. 12, where members of the Lattice team will showcase some
of its latest small form factor, low-power FPGAs, Wireless and HDMI
technologies targeting Edge connectivity and Edge computing solutions.
To schedule a press meeting, please contact: email@example.com.
To schedule a customer meeting, please visit: http://www.latticesemi.com/en/About/ContactUs.aspx.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is a leader in smart connectivity
solutions at the network edge, where the “things” of IoT live. Our low
power FPGA, 60 GHz millimeter wave, video ASSP and IP products deliver
edge intelligence, edge connectivity, and control solutions to the
consumer, communications, industrial, compute, and automotive markets.
Our unwavering commitment to our global customers enables them to
accelerate their innovation, creating an ever better and more connected
For more information about Lattice please visit www.latticesemi.com.
You can also follow us via LinkedIn, Twitter, Facebook, YouTube,
Weibo or Youku.
Lattice Semiconductor Corporation, Lattice Semiconductor (& design),
SiBEAM, SiBEAM Snap and specific product designations are either
registered trademarks or trademarks of Lattice Semiconductor Corporation
or its subsidiaries in the United States and/or other countries. The use
of the word “partner” does not imply a legal partnership between Lattice
and any other entity.
GENERAL NOTICE: Other product names used in this publication are
for identification purposes only and may be trademarks of their
View source version on businesswire.com: http://www.businesswire.com/news/home/20180109005119/en/
Source: Lattice Semiconductor Corporation
Deanna Meservey, 617-624-3415
Global IR Partners
David Pasquale, 914-337-8801