Lattice Snap Modules Drive Continued Adoption of 60 GHz Wireless
Technology in Consumer and Embedded Applications
Lattice Snap modules incorporate key benefits of SiBEAM Snap
technology for a robust, environment-proof and connector-less link at
12 Gbps speeds
International regulatory compliance speeds time-to-market
Lattice Snap evaluation kit enables easy integration of short-range 60
GHz wireless technology ideal for mobile accessories, tablets,
notebooks, action and surveillance cameras
PORTLAND, Ore.--(BUSINESS WIRE)--Feb. 20, 2018--
Semiconductor Corporation (NASDAQ: LSCC), the leading provider of
customizable smart connectivity solutions, today announced the expansion
of its Lattice Snap®
wireless connector product family to support broader adoption of 60
GHz wireless technology in consumer and embedded applications. The new Lattice
Snap modules, based on Lattice’s production-proven SiBEAM®
60 GHz technology, enable manufacturers to easily integrate short-range,
high-speed 60 GHz wireless links into their products. To simplify the
design process further, Lattice included the Snap modules, which are
compliant with regulatory requirements in several jurisdictions, into
evaluation kit for fast prototyping and time-to-market.
“We were seeking a wireless solution that was robust, easy to integrate
and wouldn’t require a lot of design support,” said Ehren Achee, CTO at
SecuraShot. “Lattice’s Snap modules met all of our expectations,
allowing us to develop a more rugged product that can seamlessly support
the transfer of data wirelessly without delay.”
The Snap modules offer 12 Gbps full-duplex bandwidth at sub-frame
latencies, making this technology ideal for the replacement of physical
connectors, such as USB. By eliminating the connector, the industrial
designs of new products can be optimized by making them thinner,
lighter, and environment-proof, all while maintaining a robust and
high-speed connection. To enable faster prototyping for both existing
and new customers, Lattice created the Snap Evaluation Kit, which
includes the modules, system design guidelines and improved de-bug tools.
“As a leader in wireless connectivity solutions, the Lattice Snap
products demonstrate our commitment to innovate products at the edge,”
said Abdullah Raouf, senior manager at Lattice. “SiBEAM Snap wireless
connector technology offers a unique advantage in data transfer for a
variety of high volume mobile applications, such as smartphones, tablets
and notebooks. The new Snap modules not only accelerate time to market,
but will enable 60 GHz technology to be easily integrated into broader
consumer and industrial products.”
Key features of the Snap modules include:
Fully integrated power regulation, timing, 60 GHz antenna design &
A plug and play approach to enabling a short range, high speed,
For more information on Lattice’s Snap products visit: http://www.latticesemi.com/Products/mmWave/SiBEAMSnap.aspx.
Lattice at the Embedded World Conference 2018 – Nuremberg, Germany
Lattice will be exhibiting at Embedded World 2018, where the company
will be showcasing Snap modules along with other products and technology
solutions targeted for the industrial, automotive and consumer markets.
To meet with Lattice, please visit hall 4, booth #4-278 at the Nuremberg
Messe from Tuesday, February 27, 2018 - Thursday, March 1, 2018.
To schedule a press meeting, please contact: email@example.com.
To schedule a customer meeting, please visit: http://www.latticesemi.com/en/About/ContactUs.aspx.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is a leader in smart connectivity
solutions at the network edge, where the “things” of IoT live. Our low
power FPGA, 60 GHz millimeter wave, video ASSP and IP products deliver
edge intelligence, edge connectivity, and control solutions to the
consumer, communications, industrial, compute, and automotive markets.
Our unwavering commitment to our global customers enables them to
accelerate their innovation, creating an ever better and more connected
For more information about Lattice please visit www.latticesemi.com.
You can also follow us via LinkedIn, Twitter, Facebook, YouTube,
Weibo or Youku.
Lattice Semiconductor Corporation, Lattice Semiconductor (& design),
SiBEAM, Snap, and specific product designations are either registered
trademarks or trademarks of Lattice Semiconductor Corporation or its
subsidiaries in the United States and/or other countries. The use of the
word “partner” does not imply a legal partnership between Lattice and
any other entity.
GENERAL NOTICE: Other product names used in this publication are
for identification purposes only and may be trademarks of their
View source version on businesswire.com: http://www.businesswire.com/news/home/20180220005046/en/
Source: Lattice Semiconductor Corporation
Deanna Meservey, 617-624-3415
Global IR Partners
David Pasquale, 914-337-8801